12 results
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UFS
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UFS
Features high capacity, high performance, and low power consumption.
- Protocol: UFS 2.2
- Voltage: UFS 2.2: VCC 2.7 ~ 3.6V ; VCCQ2 1.70 ~ 1.95V / UFS 3.1: VCC 2.4 – 2.7V ; VCCQ 1.14 ~ 1.26V
- Operating Temperature: -25~85℃
Capacity512GB | 256GB 128GB | 64GB -
Industrial Wide-temperature / Automotive Grade 2 UFS
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Industrial Wide-temperature / Automotive Grade 2 UFS
Storage ideal for automotive and computing systems that require low power consumption, high performance, and consistent reliability. Automotive-grade is AEC-Q100 qualified.
- Protocol: UFS 2.1
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
Capacity256GB | 128GB | 64GB -
eMMC
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eMMC
Features high performance, low power consumption, compatibility, and stability.
- Protocol: eMMC 5.1
- Voltage: VCCQ: 1.8V / 3.3V ; VCC: 3.3V
- Operating Temperature: -25°C~85°C
Capacity256GB | 128GB | 64GB | 32GB | 16GB | 8GB -
Industrial / Industrial Wide-temperature / Automotive eMMC
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Industrial / Industrial Wide-temperature / Automotive eMMC
High reliability ensures round-the-clock functionality throughout its long service life. Automotive grade is AEC-Q100 qualified.
- Protocol: eMMC 5.1
- Voltage: 1.8V / 3.3V
- Operating Temperature: -25°C~85°C / -40°C~85°C / -40°C~85°C(Grade 3) / -40°C~105°C(Grade 2)
Capacity128GB | 64GB | 32GB | 16GB | 8GB | 4GB -
Subsize eMMC
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Subsize eMMC
This subsize product requires less PCB space and complies with innovative eMMC products defined by JEDEC pin standards.
- Protocol: eMMC 5.1
- Operating Voltage: VCCQ: 1.8V/3.3V ; VCC: 3.3V.
- Operating Temperature: -25~85℃
Capacity32GB | 8GB | 4GB -
ePOP
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ePOP
Products that combine eMMC and LPDDR to save space on PCBs.
- Type: ePOP3 / ePOP4x
- Protocol: eMMC 5.1+LPDDR3 / eMMC 5.1+LPDDR4x
- Number of Balls: 136 / 144
- Operating Temperature: -25°C~85°C
Capacity32GB+16Gb | 32GB+8Gb | 8GB+8Gb | 8GB+4Gb -
eMCP
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eMCP
Compound products that combine eMMC and LPDDR to save space on PCBs, enabling compact and lightweight smart devices.- Type: eMCP3 / eMCP4x
- Protocol: eMMC 5.1 + LPDDR3 / eMMC 5.1 + LPDDR4x
- Operating Temperature:-25°C~85°C
Capacity128GB+32Gb | 64GB+32Gb | 32GB+16Gb | 32GB+8Gb | 16GB+4Gb -
uMCP
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uMCP
Compound product that combines UFS and LPDDR to save space on PCBs, enabling compact and light weight smart devices.
- Package: BGA254
- Protocol: UFS 2.2 + LPDDR4x
- Operating Temperature: -25°C~85°C
Capacity128GB+32Gb | 64GB+32Gb -
LPDDR
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LPDDR
RAM products that are widely used for portable devices to improve performance.
- Type: LPDDR4x / LPDDR5
- Number of Balls: 200 / 315
- Operating Temperature: -25°C~85°C
Capacity64Gb | 48Gb | 32Gb | 24Gb | 16Gb | 8Gb -
DDR3L
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DDR3L
Features a 25nm process; complies with JEDEC standards.
- Rate: Up to 1866MT/s*
- Voltage: 1.35V
- Operating Temperature: 0°C~95°C / -40°C~95°C
Capacity4Gb | 2Gb -
SPI NAND Flash
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SPI NAND Flash
Comes equipped with a general-purpose SPI and internal error correcting code (ECC). WSON8 packaging is also utilized to save PCB space.
- Package: WSON8
- Voltage: 1.8V | 3.3V
- Operating Temperature: -40℃~85℃ | -40℃~105℃ (Auto Grade 2)
Capacity4Gb | 2Gb | 1Gb | 512Mb -
Parallel SLC NAND Flash
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Parallel SLC NAND Flash
Complies with JEDEC standards.
- Package: TSOP 48L / BGA 63 / BGA 48
- Voltage: 1.8V / 3.3V
- Operating Temperature: -40℃~85℃
Capacity8Gb | 4Gb | 2Gb | 1Gb