19 results
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UFS
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UFS
Features high capacity, high performance, and low power consumption.
- Protocol: UFS 2.2
- Voltage: UFS 2.2: VCC 2.7 ~ 3.6V ; VCCQ2 1.70 ~ 1.95V / UFS 3.1: VCC 2.4 – 2.7V ; VCCQ 1.14 ~ 1.26V
- Operating Temperature: -25~85℃
Capacity512GB | 256GB 128GB | 64GB -
Automotive UFS
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Automotive UFS
Compatible with mainstream platforms. Comply with AEC-Q100 reliability standard; Supports: LDPC algorithm, Write Booster, HPB, emergency power-off protection, FFU upgrading, FBA data acceleration and other functions.High reliability and long service life to ensure the long-term operation of the equipment.Applications:
Intelligent driving system, In-car entertainment, Dashcam, Streaming rearview mirror- Flash memory medium: 3D NAND
- PPM:＜5 PPM
- Package: FBGA153
- Protocol: UFS 2.1 / UFS 3.1
- Interface: up to HS-GEAR3 2Lane / up to HS-GEAR4 2Lane
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V / UFS 3.1 VCC: 2.5V, VCCQ: 1.2V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
- Size: 11.5*13 mm
- Warranty: 3 year
Customization and Service Items:
Software/hardware customization + full pre-sales/after-sales service + customized verification test services, and more are supportedCapacity64GB | 128GB | 128GB/256GB -
Industrial Wide-temperature / Automotive Grade 2 UFS
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Industrial Wide-temperature / Automotive Grade 2 UFS
Storage ideal for automotive and computing systems that require low power consumption, high performance, and consistent reliability. Automotive-grade is AEC-Q100 qualified.
- Protocol: UFS 2.1
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
Capacity256GB | 128GB | 64GB -
eMMC
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eMMC
Features high performance, low power consumption, compatibility, and stability.
- Protocol: eMMC 5.1
- Voltage: VCCQ: 1.8V / 3.3V ; VCC: 3.3V
- Operating Temperature: -25°C~85°C
Capacity256GB | 128GB | 64GB | 32GB | 16GB | 8GB -
Industrial / Industrial Wide-temperature / Automotive eMMC
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Industrial / Industrial Wide-temperature / Automotive eMMC
High reliability ensures round-the-clock functionality throughout its long service life. Automotive grade is AEC-Q100 qualified.
- Protocol: eMMC 5.1
- Voltage: 1.8V / 3.3V
- Operating Temperature: -25°C~85°C / -40°C~85°C / -40°C~85°C(Grade 3) / -40°C~105°C(Grade 2)
Capacity128GB | 64GB | 32GB | 16GB | 8GB | 4GB -
Automotive eMMC
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Automotive eMMC
Storage ideal for automotive and computing systems that require low power consumption, high performance, and consistent reliability. Automotive-grade is AEC-Q100 qualified.
- Protocol: UFS 2.1 / UFS 3.1
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V / UFS 3.1 VCC: 2.5V, VCCQ: 1.2V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
Capacity256GB | 128GB | 64GB -
Industrial/Industrial Wide-temperature/Automotive eMMC
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Industrial/Industrial Wide-temperature/Automotive eMMC
IATF 16949 compliant
The mean time between failures (MTBF) exceeds 20 million hours.
The automotive eMMC is AEC-Q100 qualified.
The high reliability and long service life ensure working around the clock for extended periods.Applications:
Car multimedia entertainment, Dash cam, Streaming rear-view mirror, Industrial automation, Industrial IPCs, Communication base stations, Smart TVs, Wi-Fi routers, Commercial display devices
- Protocol: eMMC 5.1
- Flash memory medium: pSLC、MLC、3D NAND
- PPM:＜50 DPPM /＜20 DPPM / ＜5 DPPM
- Package: FBGA153
- Voltage: 1.8V / 3.3V
- Operating Temperature: -25°C~85°C / -40°C~85°C / -40°C~85°C(Grade 3) -40°C~105°C(Grade 2)
- Size: 11.5*13 mm / 11.5*13 mm / 11.5*13 mm
- Customization and Service Items: Software/hardware customization + full pre-sales/after-sales service + customized verification test services, and more are supported
Capacity8GB | 16GB | 32GB | 64GB | 128GB (Industrial eMMC) / 4GB | 8GB | 16GB | 32GB | 64GB (Automotive eMMC) -
Subsize eMMC
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Subsize eMMC
This subsize product requires less PCB space and complies with innovative eMMC products defined by JEDEC pin standards.
- Protocol: eMMC 5.1
- Operating Voltage: VCCQ: 1.8V/3.3V ; VCC: 3.3V.
- Operating Temperature: -25~85℃
Capacity32GB | 8GB | 4GB -
ePOP
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ePOP
Products that combine eMMC and LPDDR to save space on PCBs.
- Type: ePOP3 / ePOP4x
- Protocol: eMMC 5.1+LPDDR3 / eMMC 5.1+LPDDR4x
- Number of Balls: 136 / 144
- Operating Temperature: -25°C~85°C
Capacity32GB+16Gb | 32GB+8Gb | 8GB+8Gb | 8GB+4Gb -
eMCP
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eMCP
Compound products that combine eMMC and LPDDR to save space on PCBs, enabling compact and lightweight smart devices.- Type: eMCP3 / eMCP4x
- Protocol: eMMC 5.1 + LPDDR3 / eMMC 5.1 + LPDDR4x
- Operating Temperature:-25°C~85°C
Capacity128GB+32Gb | 64GB+32Gb | 32GB+16Gb | 32GB+8Gb | 16GB+4Gb -
uMCP
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uMCP
Compound product that combines UFS and LPDDR to save space on PCBs, enabling compact and light weight smart devices.
- Package: BGA254
- Protocol: UFS 2.2 + LPDDR4x
- Operating Temperature: -25°C~85°C
Capacity128GB+32Gb | 64GB+32Gb -
NAND-based MCP
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NAND-based MCP
Flash and LPDDR are packaged in a single package to simplify wiring design and save space. And the core voltage of 1.8V can meet the low power consumption requirements of wearable devices and the Internet of Things.
Applications:
MIFI, POS machines, feature phones, 4G modules, digital wearables
- Package: BGA 162
- Product Type: NAND-based MCP 1Gb+1Gb
- Voltage: NAND：1.8V / LPDDR2: 1.8V/1.2V
- Operating Temperature: -40℃~85℃
- Page Size: 2K Byte
- Size: 8*10.5*1.0 mm
- Warranty: 18 Months
Capacity1Gb+1Gb -
LPDDR
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LPDDR
RAM products that are widely used for portable devices to improve performance.
- Type: LPDDR4x / LPDDR5
- Number of Balls: 200 / 315
- Operating Temperature: -25°C~85°C
Capacity64Gb | 48Gb | 32Gb | 24Gb | 16Gb | 8Gb -
LPDDR3
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LPDDR3
RAM products that are widely used for portable devices to improve performance while reducing system power consumption.
- Clock Rate: 667MHz / 800MHz
- Number of Balls: 178ball
- Size: 11*11.5*1.0 mm
- Operating Temperature: -25℃~85℃
- Operating Voltage: VDDQ=1.2V
Applications:
Smartphones, Tablets, Teaching tablets, Smart TVs, TV Boxes, Smart speakers, Smart cameras, Dash camsCapacity4Gb | 8Gb -
LPDDR5
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LPDDR5
RAM products that are widely used for portable devices to improve performance while reducing system power consumption.
- Clock Rate: 2700 MHz
- Number of Balls: 315ball
- Size: 12.4*15*1.1 mm
- Operating Temperature: -25℃~85℃
- Operating Voltage: VDDQ(ODT on)=0.5V VDDQ(ODT off)=0.3V
- Warranty: 1 Year
Applications:
Smartphones, Tablets, Teaching tablets, Smart TVs, TV Boxes, Smart speakers, Smart cameras, Dash camsCapacity32Gb | 48Gb | 64Gb -
SLC SPI/PPI NAND Flash
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SLC SPI/PPI NAND Flash
Comes equipped with a general-purpose SPI and internal error correcting code (ECC) to improve data transmission efficiency and ensure data reliability. WSON8 packaging is also utilized to save PCB space.
Applications:
PON, Wi-Fi routers, smart speakers, home IPCs, industrial IPCs, set top boxes and video doorbells- Package: WSON8
- Product Type: SPI NAND Flash 512Mb / SPI NAND Flash 1Gb / SPI NAND Flash 2Gb / SPI NAND Flash 4Gb
- Interface Mode: Standard- Dual- Quad
- Voltage: 3.3V / 1.8V | 3.3V / 1.8V | 3.3V / 1.8V | 3.3V / 1.8V
- Operating Temperature: -40℃~85℃ | -40℃~85℃ | -40℃~85℃ | -40℃~85℃
- Size: 8*6 mm / 6*5 mm | 8*6 mm / 6*5 mm | 8*6 mm | 8*6 mm
Capacity512Mb | 1Gb | 2Gb | 4Gb -
DDR3L
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DDR3L
Features a 25nm process; complies with JEDEC standards.
- Rate: Up to 1866MT/s*
- Voltage: 1.35V
- Operating Temperature: 0°C~95°C / -40°C~95°C
Capacity4Gb | 2Gb -
SPI NAND Flash
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SPI NAND Flash
Comes equipped with a general-purpose SPI and internal error correcting code (ECC). WSON8 packaging is also utilized to save PCB space.
- Package: WSON8
- Voltage: 1.8V | 3.3V
- Operating Temperature: -40℃~85℃ | -40℃~105℃ (Auto Grade 2)
Capacity4Gb | 2Gb | 1Gb | 512Mb -
Parallel SLC NAND Flash
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Parallel SLC NAND Flash
Complies with JEDEC standards.
- Package: TSOP 48L / BGA 63 / BGA 48
- Voltage: 1.8V / 3.3V
- Operating Temperature: -40℃~85℃
Capacity8Gb | 4Gb | 2Gb | 1Gb