53 Results
-
UFS
Read more
UFS
Features high capacity, high performance, and low power consumption.
- Protocol: UFS 2.2
- Voltage: UFS 2.2: VCC 2.7 ~ 3.6V ; VCCQ2 1.70 ~ 1.95V / UFS 3.1: VCC 2.4 – 2.7V ; VCCQ 1.14 ~ 1.26V
- Operating Temperature: -25~85℃
Capacity512GB | 256GB 128GB | 64GB -
Automotive UFS
Read more
Automotive UFS
Compatible with mainstream platforms. Comply with AEC-Q100 reliability standard; Supports: LDPC algorithm, Write Booster, HPB, emergency power-off protection, FFU upgrading, FBA data acceleration and other functions.High reliability and long service life to ensure the long-term operation of the equipment.Applications:
Intelligent driving system, In-car entertainment, Dashcam, Streaming rearview mirror- Flash memory medium: 3D NAND
- PPM:＜5 PPM
- Package: FBGA153
- Protocol: UFS 2.1 / UFS 3.1
- Interface: up to HS-GEAR3 2Lane / up to HS-GEAR4 2Lane
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V / UFS 3.1 VCC: 2.5V, VCCQ: 1.2V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
- Size: 11.5*13 mm
- Warranty: 3 year
Customization and Service Items:
Software/hardware customization + full pre-sales/after-sales service + customized verification test services, and more are supportedCapacity64GB | 128GB | 128GB/256GB -
Industrial Wide-temperature / Automotive Grade 2 UFS
Read more
Industrial Wide-temperature / Automotive Grade 2 UFS
Storage ideal for automotive and computing systems that require low power consumption, high performance, and consistent reliability. Automotive-grade is AEC-Q100 qualified.
- Protocol: UFS 2.1
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
Capacity256GB | 128GB | 64GB -
eMMC
Read more
eMMC
Features high performance, low power consumption, compatibility, and stability.
- Protocol: eMMC 5.1
- Voltage: VCCQ: 1.8V / 3.3V ; VCC: 3.3V
- Operating Temperature: -25°C~85°C
Capacity256GB | 128GB | 64GB | 32GB | 16GB | 8GB -
Industrial / Industrial Wide-temperature / Automotive eMMC
Read more
Industrial / Industrial Wide-temperature / Automotive eMMC
High reliability ensures round-the-clock functionality throughout its long service life. Automotive grade is AEC-Q100 qualified.
- Protocol: eMMC 5.1
- Voltage: 1.8V / 3.3V
- Operating Temperature: -25°C~85°C / -40°C~85°C / -40°C~85°C(Grade 3) / -40°C~105°C(Grade 2)
Capacity128GB | 64GB | 32GB | 16GB | 8GB | 4GB -
Automotive eMMC
Read more
Automotive eMMC
Storage ideal for automotive and computing systems that require low power consumption, high performance, and consistent reliability. Automotive-grade is AEC-Q100 qualified.
- Protocol: UFS 2.1 / UFS 3.1
- Voltage: UFS 2.1 VCC: 3.3V, VCCQ2: 1.8V / UFS 3.1 VCC: 2.5V, VCCQ: 1.2V
- Operating Temperature: IWT: -40°C~85°C ; Auto -40°C~105°C
Capacity256GB | 128GB | 64GB -
Industrial/Industrial Wide-temperature/Automotive eMMC
Read more
Industrial/Industrial Wide-temperature/Automotive eMMC
IATF 16949 compliant
The mean time between failures (MTBF) exceeds 20 million hours.
The automotive eMMC is AEC-Q100 qualified.
The high reliability and long service life ensure working around the clock for extended periods.Applications:
Car multimedia entertainment, Dash cam, Streaming rear-view mirror, Industrial automation, Industrial IPCs, Communication base stations, Smart TVs, Wi-Fi routers, Commercial display devices
- Protocol: eMMC 5.1
- Flash memory medium: pSLC、MLC、3D NAND
- PPM:＜50 DPPM /＜20 DPPM / ＜5 DPPM
- Package: FBGA153
- Voltage: 1.8V / 3.3V
- Operating Temperature: -25°C~85°C / -40°C~85°C / -40°C~85°C(Grade 3) -40°C~105°C(Grade 2)
- Size: 11.5*13 mm / 11.5*13 mm / 11.5*13 mm
- Customization and Service Items: Software/hardware customization + full pre-sales/after-sales service + customized verification test services, and more are supported
Capacity8GB | 16GB | 32GB | 64GB | 128GB (Industrial eMMC) / 4GB | 8GB | 16GB | 32GB | 64GB (Automotive eMMC) -
Subsize eMMC
Read more
Subsize eMMC
This subsize product requires less PCB space and complies with innovative eMMC products defined by JEDEC pin standards.
- Protocol: eMMC 5.1
- Operating Voltage: VCCQ: 1.8V/3.3V ; VCC: 3.3V.
- Operating Temperature: -25~85℃
Capacity32GB | 8GB | 4GB -
ePOP
Read more
ePOP
Products that combine eMMC and LPDDR to save space on PCBs.
- Type: ePOP3 / ePOP4x
- Protocol: eMMC 5.1+LPDDR3 / eMMC 5.1+LPDDR4x
- Number of Balls: 136 / 144
- Operating Temperature: -25°C~85°C
Capacity32GB+16Gb | 32GB+8Gb | 8GB+8Gb | 8GB+4Gb -
eMCP
Read more
eMCP
Compound products that combine eMMC and LPDDR to save space on PCBs, enabling compact and lightweight smart devices.- Type: eMCP3 / eMCP4x
- Protocol: eMMC 5.1 + LPDDR3 / eMMC 5.1 + LPDDR4x
- Operating Temperature:-25°C~85°C
Capacity128GB+32Gb | 64GB+32Gb | 32GB+16Gb | 32GB+8Gb | 16GB+4Gb -
uMCP
Read more
uMCP
Compound product that combines UFS and LPDDR to save space on PCBs, enabling compact and light weight smart devices.
- Package: BGA254
- Protocol: UFS 2.2 + LPDDR4x
- Operating Temperature: -25°C~85°C
Capacity128GB+32Gb | 64GB+32Gb -
NAND-based MCP
Read more
NAND-based MCP
Flash and LPDDR are packaged in a single package to simplify wiring design and save space. And the core voltage of 1.8V can meet the low power consumption requirements of wearable devices and the Internet of Things.
Applications:
MIFI, POS machines, feature phones, 4G modules, digital wearables
- Package: BGA 162
- Product Type: NAND-based MCP 1Gb+1Gb
- Voltage: NAND：1.8V / LPDDR2: 1.8V/1.2V
- Operating Temperature: -40℃~85℃
- Page Size: 2K Byte
- Size: 8*10.5*1.0 mm
- Warranty: 18 Months
Capacity1Gb+1Gb -
LPDDR
Read more
LPDDR
RAM products that are widely used for portable devices to improve performance.
- Type: LPDDR4x / LPDDR5
- Number of Balls: 200 / 315
- Operating Temperature: -25°C~85°C
Capacity64Gb | 48Gb | 32Gb | 24Gb | 16Gb | 8Gb -
LPDDR3
Read more
LPDDR3
RAM products that are widely used for portable devices to improve performance while reducing system power consumption.
- Clock Rate: 667MHz / 800MHz
- Number of Balls: 178ball
- Size: 11*11.5*1.0 mm
- Operating Temperature: -25℃~85℃
- Operating Voltage: VDDQ=1.2V
Applications:
Smartphones, Tablets, Teaching tablets, Smart TVs, TV Boxes, Smart speakers, Smart cameras, Dash camsCapacity4Gb | 8Gb -
LPDDR5
Read more
LPDDR5
RAM products that are widely used for portable devices to improve performance while reducing system power consumption.
- Clock Rate: 2700 MHz
- Number of Balls: 315ball
- Size: 12.4*15*1.1 mm
- Operating Temperature: -25℃~85℃
- Operating Voltage: VDDQ(ODT on)=0.5V VDDQ(ODT off)=0.3V
- Warranty: 1 Year
Applications:
Smartphones, Tablets, Teaching tablets, Smart TVs, TV Boxes, Smart speakers, Smart cameras, Dash camsCapacity32Gb | 48Gb | 64Gb -
SLC SPI/PPI NAND Flash
Read more
SLC SPI/PPI NAND Flash
Comes equipped with a general-purpose SPI and internal error correcting code (ECC) to improve data transmission efficiency and ensure data reliability. WSON8 packaging is also utilized to save PCB space.
Applications:
PON, Wi-Fi routers, smart speakers, home IPCs, industrial IPCs, set top boxes and video doorbells- Package: WSON8
- Product Type: SPI NAND Flash 512Mb / SPI NAND Flash 1Gb / SPI NAND Flash 2Gb / SPI NAND Flash 4Gb
- Interface Mode: Standard- Dual- Quad
- Voltage: 3.3V / 1.8V | 3.3V / 1.8V | 3.3V / 1.8V | 3.3V / 1.8V
- Operating Temperature: -40℃~85℃ | -40℃~85℃ | -40℃~85℃ | -40℃~85℃
- Size: 8*6 mm / 6*5 mm | 8*6 mm / 6*5 mm | 8*6 mm | 8*6 mm
Capacity512Mb | 1Gb | 2Gb | 4Gb -
DDR3L
Read more
DDR3L
Features a 25nm process; complies with JEDEC standards.
- Rate: Up to 1866MT/s*
- Voltage: 1.35V
- Operating Temperature: 0°C~95°C / -40°C~95°C
Capacity4Gb | 2Gb -
SPI NAND Flash
Read more
SPI NAND Flash
Comes equipped with a general-purpose SPI and internal error correcting code (ECC). WSON8 packaging is also utilized to save PCB space.
- Package: WSON8
- Voltage: 1.8V | 3.3V
- Operating Temperature: -40℃~85℃ | -40℃~105℃ (Auto Grade 2)
Capacity4Gb | 2Gb | 1Gb | 512Mb -
Parallel SLC NAND Flash
Read more
Parallel SLC NAND Flash
Complies with JEDEC standards.
- Package: TSOP 48L / BGA 63 / BGA 48
- Voltage: 1.8V / 3.3V
- Operating Temperature: -40℃~85℃
Capacity8Gb | 4Gb | 2Gb | 1Gb -
Enterprise PCIe SSD: ORCA 4836
Read more
Enterprise PCIe SSD: ORCA 4836
Superior Performance
- High Performance
- Consistency: Rand Write 95+%, Rand Read 99+%
- Stable Performance Effective QoS for latency-sensitive data center applications
Power Efficiency & Tuning
- Maximal 14W, Idle 4.5W
- 9 variable Power Levels ; ranging 14W ~ 5W
Advanced NVMe Features
- 32 Multiple Namespaces
- Multiple sector sizes : 512, 520, 4096, 4104, 4160 Bytes
- Customizable Telemetry and SMART Log
- Sanitize and S.M.A.R.T Supported
- PRP/SGL Data Transfer
Safety
- Secure Boot with drive individual key
- Secure Download with RSA Integrity Check
Reliability
- Enhanced Power-Loss Data Protection
- 5 Multiple Streams
- Full path End to End Data Protection
- RAIN Protection
- MTTF : 2 Million Device Hours
- UBER < 1 sector per 10^17 bits read
- Interface: PCIe Gen4 x4, NVMe 1.4b
- Form Factors: U.2
- 128K Sequential Performance: 6800MB/s Read 4600MB/s Write
- 4K Random Performance (IOPS): 1000K Read
390K Write - Endurance (DWPD): 1/3 DWPD (5 Years)
- Warranty: 5 Years
Capacity1.92Tb | 3.84Tb | 7.68Tb | 3.2Tb | 6.4Tb -
PCIe BGA SSD
Read more
PCIe BGA SSD
FORESEE’s first proprietary XP2200 PCIe Gen4 BGA SSD for more lightweight mobile smart terminals. Advanced process technology with new heat-dissipation materials and software technologies to optimize heat dissipation. Cutting-edge packaging and testing techniques enable high-rise stacking technology.
- Interface: PCIe Gen4*2
- Type: BGA(11.5*13mm)
- Model (XXXX represents capacity：XP2200FXXXX
- Flash Memory Medium：3D TLC
- DRAM： DRAM-less
- Operating Temperature: -25℃~85℃ / 0℃~70°C
- Sequential Read/Write Speed*: Up to 3500MB/s / 3400MB/s
- Random Read/Write Speed (IOPS)*: Up to 566K / 678K
- Mean Time Between Failures (Hour): 1500000
- TRIM Function： Yes
- S.M.A.R.T. Function Support：Yes
- Warranty：3 years
Applications:
Laptops, Desktops, All-in-one computers, Home IPCsCapacity128b | 256Gb | 512Gb | 1Tb -
PCIe SSD (additional FF)
Read more
PCIe SSD (additional FF)
Supports PCIe Gen4*4 standard for high-performance PC devices
TCG-OPAL 2.0 and Pyrite 2.0 encryption to ensure security of user data
L1.2 to reduce power consumption and extend service life
Temperature control algorithm to balance speed and temperature during operation- Interface: PCIe Gen4*4
- Type: M.2 2280/2230/2242
- Model (XXXX represents capacity：XP2000FXXXX
- Flash Memory Medium：3D TLC
- DRAM： DRAM-less
- Operating Temperature: 0℃~70°C
- Sequential Read/Write Speed*: Up to 5200MB/s / 4700MB/s
- Random Read/Write Speed (IOPS)*: Up to 800K / 940K
- Mean Time Between Failures (Hour): 1500000
- Warranty：3 years
- TRIM Function： Yes
- S.M.A.R.T. Function Support：Yes
Applications:
Laptops, Desktops, All-in-one computers, Home IPCsCapacity256Gb | 512Gb | 1Tb -
XP1000 PCIe SSD
Read more
XP1000 PCIe SSD
A next-generation flagship product. Additional channels and higher Flash FPS bring about high speed performance.
- Type: M.2 2280
- Interface: PCIe Gen 3×4
- Sequential Read/Write Speed: Up to 3500MB/s /
3200MB/s* - IOPS: Up to 366K / 286K*
- Operating Temperature: 0°C~70°C
Capacity2TB | 1TB | 512GB | 256GB | 128GB -
S435 SATA SSD
Read more
S435 SATA SSD
Supports up to 24 channels of vehicle monitoring systems and devices.
- Type: 2.5inch / M.2 2280
- Interface: SATA III
- Sequential Read/Write Speed: Up to 540MB/s / 510MB/s
- IOPS: Up to 46K / 55K
- Operating Temperature: 0°C~70°C
Capacity2TB | 1TB | 512GB | 256GB