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Overview
Specifications Applications Key Benefits

NAND-based MCP

NAND-based MCP​

A boot code source and DRAM in a single package to improve board space savings and optimize layout. Want to learn more about this product? Our sales team is ready to help.

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NAND-based MCP​
Details
NAND Flash
SLC NAND x8
Type
SLC NAND + LPDDR2/4/4x
Voltage
SLC NAND: 1.8V / LPDDR2: VDDQ 1.2V / LPDDR4: VDDQ 1.1V / LPDDR4/4x: VDDQ 1.1V or 0.6V / LPDDR4x: VDDQ 0.6V
Number of Balls
162b, 149b
Operating Temperature
-40°C to +85°C / -40°C to +105°C
Capacity
1GB + 1GB | 2GB + 1GB | 2GB + 2GB | 4GB + 2GB | 4GB + 6GB | 4GB + 8GB | 8GB + 6GB | 8GB + 8GB
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Specifications

LPDDR2 NAND-based MCP

Capacity (Size)
Part Number
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1Gb+1Gb (10.5mm x 0.8mm)
F70ME0101F-RW
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2Gb+1Gb (10.5mm x 0.8mm)
F70ME0201F-RWT
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2Gb+2Gb (10.5mm x 0.8mm)
F70ME0202A-RWT
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4Gb+2Gb (10.5mm x 0.8mm)
F70ME0402A-RWT
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4Gb+6Gb (9.5mm x 0.8mm)
F70NH0406A-SWT
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Sample available
4Gb+6Gb (9.5mm x 0.8mm)
F70NH0406A-SAT
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4Gb+8Gb (9.5mm x 0.8mm)
F70NH0408A-SWT
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4Gb+8Gb (9.5mm x 0.8mm)
F70NH0408A-SAT
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8Gb+6Gb (9.5mm x 0.8mm)
F70NH0806A-SWT
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8Gb+6Gb (9.5mm x 0.8mm)
F70NH0806A-SAT
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8Gb+8Gb (9.5mm x 0.8mm)
F70NH0808A-SWT
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Sample available
8Gb+8Gb (9.5mm x 0.8mm)
F70NH0808A-SAT
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Sample available

Applications

Mobile Phones

4G/5G Wireless Modules

Digital Cameras

Internet of Things (IoT) Devices

Laptop Computers

Key Benefits

An All-in-one Chip

SLC and LPDDR DRAM multi-chip package memory provides two-die in one package, delivering an all-in-one solution to support an optimized interface.

Fits in Tight Spaces

A minimal package footprint routes signals to a single component to provide an easier, efficient package footprint that provides excellent PCB space savings.

Optimized Power Efficiency

10mA is typical data for all the SLC NAND in the market, it couldn’t be taken as special/optimized feature.